Even before everyone could comprehend the more than 30 5G smartphones using Qualcomm’s first generation 5G solutions and the new Lenovo always-Connected PC (ACPC) using the new Snapdragon 8CX introduced at MWC, Qualcomm announced its second-generation 5G platform featuring a flurry on new chipsets for future 5G devices.
First, Qualcomm introduced the X55 5G modem offering more performance and lower power than the current X50 modem. The 7nm modem supports full-dimension MIMO (FD-MIMO), spectrum sharing 4G and 5G services, dual-frequency GNSS location tracking, stand-alone and non-standalone modes and up to 7Gbps bandwidth. The X55 will be targeted at a wide range of applications ranging from mobile devices to PCs and cars. Accompanying the new 5G modem is a second-generation mmWave antenna module, the QTM525, that is smaller at 8mm and adds support for the 26 GHz, 28 GHz, and 39 GHz frequency bands.
Qualcomm also introduced the first 5G 100MHz envelope tracker (QET6100) that provides 2x the power efficiency and higher 256-QAM modulation; a new adaptive antenna tuner (QAT3555) that is smaller and supports more antennas; a second-generation RF front-end (RFFE) supporting both sub-6 GHz and mmWave bands; and new 5G power amplifier (PA) and diversity modules.
The company also introduced the QCA65390 Wi-Fi 6 chipset for mobile devices. The new chipset features WPA3 security, 8x8 MIMO, Bluetooth 5.1, Target Wake-up, dual-band simultaneous, 1024 QAM, 8-stream sounding and up to 1.8Gbps bandwidth. The QCA6390 also reduces that latency for audio streaming down to 80ms while supporting super-wideband codecs.
The second-generation 5G platform will likely be incorporated into phones and mobile devices introduced in late 2019. Qualcomm also hinted to a new Snapdragon SoC, or more likely a family of SoCs, that will feature an integrated 5G modem available later this year for devices in 2020. This will help the company bring the 5G to a broader range of smartphones and other IoT devices.
It was no surprise to see almost all the new 5G devices using Qualcomm’s 5G platform ranging from the SoC to the RFFE. It was a surprise, however, to see a completely new platform even before the devices using the first generation are in consumers’ hands. Qualcomm is not the only company working on 5G silicon solutions, but it maintains a significant lead over its competitors and does not appear to be slowing the pace of new technology or product introductions. The company had so many announcements at MWC, it is difficult to keep track of them all and some of the announcements will be featured in other articles.
Much like semiconductor manufacturers struggled to keep pace with Intel’s semiconductor process technology, Qualcomm’s competitors are struggling to keep pace with the company’s wireless technologies and there is no end in sight.
The author and members of the TIRIAS Research staff do not hold equity positions in any of the companies mentioned. TIRIAS Research tracks and consults for companies throughout the electronics ecosystem from semiconductors and sensors to the cloud. Members of the TIRIAS Research team have consulted for Intel, Qualcomm, and other companies throughout the mobile and wireless ecosystem.
